Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for encapsulating a ceramic device for embedding in composite structures

Method for encapsulating a ceramic device for embedding in composite structures

US Patent 5305507 · Granted Apr 26, 1994

Estimated economic value: $2,847,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microdroplet manipulation device2025
Microfluidic analytical device2024
Microdroplet manipulation device2024
Microdroplet manipulation device2024
Microfluidic analytical device2022
Microdroplet manipulation device2021
Containment system for spills2002
Digital control of smart structures2001
Containment system for spills2001
Smart structures for vibration suppression2001
Method for encapsulating a ceramic device for embedding in composite structures1999
Method for encapsulating a ceramic device for embedding in composite structures1999