Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrates used in multilayered integrated circuits and multichips

Substrates used in multilayered integrated circuits and multichips

US Patent 5292548 · Granted Mar 8, 1994

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Surround print process for the manufacture of electrode embedded dielectric gree1996
Pre-engineered electrode/dielectric composite film and related manufacturing pro1992