Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package for semiconductor device with at least one through hole

Package for semiconductor device with at least one through hole

US Patent 5256900 · Granted Oct 26, 1993

Estimated economic value: $28,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method for manufacturing the same2021
Method for fabricating semiconductor device and lead frame2021
Manufacturing method of semiconductor device and semiconductor device2020
Semiconductor device2019
Manufacturing method of semiconductor device and semiconductor device2019
Method of manufacturing a semiconductor device comprising a semiconductor chip m2018
Semiconductor device comprising a semiconductor chip mounted over a metal plate 2017
Optical coupling element and method for manufacturing the same2014