Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level reliability contact test structure and method

Wafer level reliability contact test structure and method

US Patent 5239270 · Granted Aug 24, 1993

Estimated economic value: $6,587,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrical connectivity for circuit applications2019
Electrical connectivity for circuit applications2019
Electrical connectivity for circuit applications2016
Electrical connectivity for circuit applications2015
Electrical connectivity for circuit applications2014
Electrical connectivity for circuit applications2014
Electrical connectivity for circuit applications2013
Integrated fuel cell power conditioning with added functional control2006
Enhanced density modified isoplanar process1989