Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Aligned wafer bonding

Aligned wafer bonding

US Patent 5236118 · Granted Aug 17, 1993

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for passing photovoltaic current between a subcell formed from a group II2022
Float mobile2021
Integrated automotive system, nozzle assembly and remote control method for clea2019
Integrated automotive system, nozzle assembly and remote control method for clea2019
Tunnel heterojunctions in Group IV/Group II-IV multijunction solar cells2019
Tunnel homojunctions in group IV / group II-VI multijunction solar cells2016
Light emission from semiconductor integrated circuits2009
Smooth thin film layers produced by low temperature hydrogen ion cut2006
Light emission from semiconductor integrated circuits2006
Transposed split of ion cut materials2004
Transposed split of ion cut materials2002
Nitrogen based low temperature direct bonding1996