Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having window-frame flag with tapered edge in opening

Semiconductor device having window-frame flag with tapered edge in opening

US Patent 5233222 · Granted Aug 3, 1993

Estimated economic value: $11,404,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor die edge reconditioning2008
Packaged semiconductor with coated leads and method therefore2006
Packaged integrated circuit having wire bonds and method therefor2006
Inductive device including bond wires2006
Low profile semiconductor device with like-sized chip and mounting substrate1998
Semiconductor device having contoured package body profile1998
Method of packaging a semiconductor device1997
Molded carrier ring leadframe having a particular resin injecting area design fo1996
Method for making semiconductor device having no die supporting surface1995
Semiconductor device having x-shaped die support member and method for making th1995
Method for encapsulating semiconductor devices with package bodies1994
Semiconductor device having universal low-stress die support and method for maki1994