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Home › Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications

Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications

US Patent 5232970 · Granted Aug 3, 1993

Estimated economic value: $5,663,000 ⓘ

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