Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for improving adhesion to polymide surfaces

Method for improving adhesion to polymide surfaces

US Patent 5213840 · Granted May 25, 1993

Estimated economic value: $807,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for enhancing the solderability of a surface2016
Method for enhancing the solderability of a surface2016
Method for enhancing the solderability of a surface2014
Polyimide substrate and method of manufacturing printed wiring board using the s2010
Method for the manufacture of printed circuit boards with plated resistors2007
Method for enhancing the solderability of a surface2007
Process for preparing a non-conductive substrate for electroplating2007
Methods of cleaning copper surfaces in the manufacture of printed circuit boards2006
Method for the manufacture of printed circuit boards with plated resistors2006
Integral plated resistor and method for the manufacture of printed circuit board2006
Method for enhancing the solderability of a surface2005
Method of stripping silver from a printed circuit board2004