Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stress reduction structure for a resin sealed semiconductor device

Stress reduction structure for a resin sealed semiconductor device

US Patent 5187558 · Granted Feb 16, 1993

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thin film capacitor, circuit board incorporating the same, and thin film capacit2023
Wireless communication terminal2022
Electronic component-incorporating substrate2022
Electric component embedded structure2022
Thin-film capacitor and method for manufacturing thin-film capacitor2022
Thin-film capacitor2021
Thin-film capacitor2021
Electronic component mounting package2021
Electronic component embedded substrate2020
Electronic component embedded substrate2019
Thin-film capacitor2019
Electronic component embedded substrate2019