Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents

Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents

US Patent 5162439 · Granted Nov 10, 1992

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Unsaturated nitrile-conjugated diene copolymer process for producing same and vu1998
Unsaturated nitrile-conjugated diene copolymer, process for producing same and v1997
Unsaturated nitrile-conjugated diene copolymer, process for producing same and r1997
Adhesive composition1994
Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer 1992
Process for preparing unsaturated nitrile/conjugated diene copolymer rubber1992
Process for producing conjugated diene copolymer1992