Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sealing system for hermetic microchip packages

Sealing system for hermetic microchip packages

US Patent 5081327 · Granted Jan 14, 1992

Estimated economic value: $3,917,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid selection of target for advertisement campaign2023
Vehicle interior part and method of manufacturing same2020
Two-axis slider graphical user interface system and method2020
Hybrid selection of target for advertisement campaign2020
LDMOS transistor heatsink package assembly and manufacturing method2002
High temperature co-fired ceramic and low temperature co-fired ceramic combinati2002
Process for the dehydration of a gas1997
Ceramic package and method for making same1993
Geometric fiedlity of imaging systems employing sensor arrays1992
Cementious pattern imparting tool1991
Low cost, hermetic pin grid array package1989
Antistatic, fabric-softening detergent additive1981