Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for reducing chemical interaction between copper features and photosensitive dielectric compositions

Method for reducing chemical interaction between copper features and photosensitive dielectric compositions

US Patent 5081005 · Granted Jan 14, 1992

Estimated economic value: $51,518,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dielectric comb for MEMS device2023
System and method for detecting tactile interaction based on surface variations 2022
Pellicle frame and lithographic pellicle2013
Pellicle frame and lithographic pellicle2012
Pellicle frame and lithographic pellicle2012
Mechanically activated objects for treatment of degenerative retinal disease2011
Low stress pellicle frames and reticle pellicle assemblies2010
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded 2009
Optoelectrical package2008
Electronic assemblies and systems comprising interposer with embedded capacitors2008
Data processing system comprising ceramic/organic hybrid substrate with embedded2006
Conductive core substrate fabrication2006