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Home › Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diarliodonium-hexafluoroantimonate salts and free radical generators

Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diarliodonium-hexafluoroantimonate salts and free radical generators

US Patent 5064882 · Granted Nov 12, 1991

Estimated economic value: $10,695,000 ⓘ

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