Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate of a hybrid IC, method of forming a circuit pattern and apparatus of forming the same

Substrate of a hybrid IC, method of forming a circuit pattern and apparatus of forming the same

US Patent 5064711 · Granted Nov 12, 1991

Estimated economic value: $43,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Organic electronic material and use thereof2025
Surface-treated steel sheet, metal container, and method for manufacturing surfa2024
Surface-treated steel sheet, metal container, and method for producing surface-t2024
Vehicle display device2024
Surface-treated steel sheet, metal container, and method for producing surface-t2023
In-situ stress measurement method2022
Electronic component and method of manufacturing electronic component2022
Head-up display device and display control method2022
Ferrite laminate and noise suppression sheet2021
Ferrite sintered plate and ferrite sintered sheet2020
Moving image display apparatus2018
Multilayer ceramic capacitor2018