Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for reliability testing integrated circuit metal films

Method for reliability testing integrated circuit metal films

US Patent 5057441 · Granted Oct 15, 1991

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wireless signal validation using a one-way function and an initially unknown inp2025
Low cost, size, weight, and power (CSWAP) geolocation capability utilizing signa2025
Satellite-based source of positioning system-independent position navigation and2024
Wireless signal validation using an independent wireless data link2024
Validation of position, navigation, time signals2024
Validation of position, navigation, time signals2022
Server algorithms to improve space based authentication2020
Geolocation using acquisition signals2018
Server algorithms to improve space based authentication2017
Geolocation leveraging spot beam overlap2017
Correcting for time delay variation in a satellite for positioning, navigation o2017
Satellite-based integer cycle ambiguity resolution of local medium wave radio si2016