Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for reliable integrated circuit package construction

Method and apparatus for reliable integrated circuit package construction

US Patent 4993534 · Granted Feb 19, 1991

Estimated economic value: $3,254,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Information retrieval system and method employing spatially selective features2010
Sleeping structure2006
Sleeping structure2006
Sleeping structure2004
Headrest1999
Lead frame lead located for wire bonder1992
Method for making matrix lead frame1989
Integrated circuit package having interconnected leads adjacent the package ends1985
Postal scale1984