Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling

Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling

US Patent 4941530 · Granted Jul 17, 1990

Estimated economic value: $2,294,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Heat exchanger for high power electrical component and package incorporating sam1998
Heat exchanger for high power electrical component1997
Electric power distribution module for an electric power generation and distribu1995
Dual cooling system1993
Converter and inverter support module1993
Modular circuit board1992
Method of manufacturing hermetically sealed compression bonded circuit assemblie1991
Compression bonded semiconductor device having a plurality of stacked hermetical1991
Hermetically sealed compression bonded circuit assembly having a suspension for 1991
Power converter circuit board1990
Power converter circuit board1990
Stacked power converter1990