Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead frame and method of fabricating a semiconductor device

Lead frame and method of fabricating a semiconductor device

US Patent 4912546 · Granted Mar 27, 1990

Estimated economic value: $66,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing laminated core2012
Laminated core and method of producing laminated core2011
Method of manufacturing laminated core2010
Skew shape variable laminated iron core and method of manufacturing the same2008
Production method of amorphous laminate core and amorphous laminate core2006
Lead frame having chip mounting part and leads of different thicknesses2005
Method of forming a lead frame1987