Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip interconnection package

Multi-chip interconnection package

US Patent 4901136 · Granted Feb 13, 1990

Estimated economic value: $10,471,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of fabricating a circuit structure2013
Integrated thermal structures and fabrication methods thereof facilitating imple2013
Method of bonding two structures together with an adhesive line of controlled th2013
Method of fabricating a base layer circuit structure2013
Integrated conductive structures and fabrication methods thereof facilitating im2013
Integrated conductive structures and fabrication methods thereof facilitating im2012
Self regulating power conditioner for energy harvesting applications2012
Method for reducing defect concentration in crystals2012
Stackable circuit structures and methods of fabrication thereof2012
Power aware techniques for energy harvesting remote sensor system2012
Integrated structures and methods of fabrication thereof with fan-out metallizat2011
Packaged electronic modules and fabrication methods thereof implementing a cell 2011