Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate

Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate

US Patent 4878611 · Granted Nov 7, 1989

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Panel positioning method2001
Panel positioning method2001
Methods for registering a warranty for a wireless device2001
Panel positioning method and apparatus1999
Panel positioning method and apparatus1999
Liquid thermal cycling methods and apparatus1994
Solder assembly of components1991
Solder assembly of components1991
Localized soldering by inductive heating1991
Process and apparatus for controlling losses in volatile working fluid systems1981
Flexible circuit reflow soldering machine1981