Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Technique for fabricating complementary dielectrically isolated wafer

Technique for fabricating complementary dielectrically isolated wafer

US Patent 4820653 · Granted Apr 11, 1989

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrically conductive composite material and method2024
Complex composite particles and methods2023
Functional composite particles2022
Electrodes and process for reconditioning contaminated electrode materials for u2022
Inorganic polymers and compositions for improved 3D printing of larger scale cer2021
Composite tile and method of manufacture2021
Fracking proppant and method of manufacture2021
Carbon ceramic composites and methods2021
Ceramic composite structures and processing technologies2019
Composite ceramics and ceramic particles and method for producing ceramic partic2019
Additive manufacturing 3D printing of advanced ceramics2018
Composite ceramics and ceramic particles and method for producing ceramic partic2017