Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Soldering method using localized heat source

Soldering method using localized heat source

US Patent 4785156 · Granted Nov 15, 1988

Estimated economic value: $117,802,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for bonding aluminized optical fiber1995
MOCVD method and apparatus1993
Compression bonding methods1993
MOCVD method and apparatus1992
Laser soldering method and apparatus1991
Laser soldering method and apparatus1991
Method for hermetically sealing electronic devices1991
Method for hermetically sealing electronic devices1991
Methods and apparatus for extruding articles1983
Method and apparatus for extruding glass tubes1982
Method for extruding articles1980