Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process and apparatus for etching copper base materials

Process and apparatus for etching copper base materials

US Patent 4725374 · Granted Feb 16, 1988

Estimated economic value: $1,911,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Anodized aluminum substrate having increased breakdown voltage1997
Corrosion-resistant bismuth brass1997
Anodized aluminum substrate having increased breakdown voltage1996
Aluminum base alloy1996
Aluminum base alloy and method for preparing same1995
Anodized aluminum electronic package components1995
Surface topography optimization through control of chloride concentration in ele1993
Process for producing black integrally colored anodized aluminum components1991
Process for etching copper base materials1990
Process for etching copper base materials1990
Method and apparatus for forming ultra-small optical fiber cable assemblies1990
Semiconductor die attach system1990