Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for making porous bottom-layer dielectric composite structure

Method for making porous bottom-layer dielectric composite structure

US Patent 4724021 · Granted Feb 9, 1988

Estimated economic value: $12,184,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Screen-printable encapsulants based on polyhydroxyamides that thermally convert 2013
Screen-printable encapsulants based on soluble polybenzoxazoles2012
Composition of polyimide and sterically-hindered hydrophobic epoxy2010
Metal ferrocyanide-polymer composite layer within a flexible electrochromic devi2009
Polyimide composite coverlays and methods and compositions relating thereto2009
Low-temperature curable photosensitive compositions2009
Low-temperature curable photosensitive compositions2009
Adhesive ion-conducting layer for flexible electrochromic devices2008
Polyimide compositions having resistance to water sorption, and methods relating2008
Polyimide based adhesive compositions useful in flexible circuit applications, a2007
Flexible electrochromic devices2002
Flexible, flame-retardant, aqueous-processable photoimageable composition for co2001