Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for repair of opens in thin film lines on a substrate

Method for repair of opens in thin film lines on a substrate

US Patent 4704304 · Granted Nov 3, 1987

Estimated economic value: $100,914,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanc2023
Seal compositions, methods, and structures for planar solid oxide fuel cells2020
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanc2020
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanc2019
Seal compositions, methods, and structures for planar solid oxide fuel cells2018
Silicon composite substrates2018
Structure and method for high performance large-grain-poly silicon backplane for2018
Silicon-based backplane structures and methods for display applications2017
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanc2017
Method of electrochemically fabricating multilayer structures having improved in2017
Methods of forming three-dimensional structures having reduced stress and/or cur2017
Seal compositions, methods, and structures for planar solid oxide fuel cells2016