Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making copper colloid for activating insulating surfaces

Method of making copper colloid for activating insulating surfaces

US Patent 4681630 · Granted Jul 21, 1987

Estimated economic value: $653,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cyanide-free monovalent copper electroplating solutions1998
Cyanide-free plating solutions for monovalent metals1997
Nickel hypophosphite manufacture1996
Electrolytic production of hypophosphorous acid1996
Cyanide-free plating solutions for monovalent metals1994
Electroplated gold-copper-silver alloys1993
Electroplated gold-copper-zinc alloys1992
Formaldehyde-free electroless copper plating solutions1989
Preparation of printed circuit boards by selective metallization1989
Copper colloid and method of activating insulating surfaces for subsequent elect1988
Process for printed circuit board manufacture1988
Process for printed circuit board manufacture1988