Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for automatically bonding a leadwire on a semiconductor

Method and system for automatically bonding a leadwire on a semiconductor

US Patent 4671446 · Granted Jun 9, 1987

Estimated economic value: $117,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated optic system for monitoring blood pressure1988
Optical correlator using electronic image preprocessing1987
Forming and reading holograms1984
On-line inspection method and system for bonds made to electronic components1984