Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High temperature epoxy resin composition with reduced viscosity

High temperature epoxy resin composition with reduced viscosity

US Patent 4661578 · Granted Apr 28, 1987

Estimated economic value: $2,442,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device for making a part of a composite material by resin-transfer moulding2017
Implantable medical device with openings for delivery of beneficial agents with 2016
Rapamycin reservoir eluting stent2016
System and method for loading a beneficial agent into a medical device2015
Adhesion promoting temporary mask for coated surfaces2015
E beam sterilization of medical devices comprising bioactive coating2014
Composition, system, and method for modulating release kinetics in implantable d2014
Implantable medical device with beneficial agent concentration gradient2013
Systems and methods for sealing a vascular puncture2012
System and method for loading a beneficial agent into a medical device2011
System and method for loading a beneficial agent into a medical device2011
Adhesion promoting primer for coated surfaces2010