Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-wafer slicing with a fixed abrasive

Multi-wafer slicing with a fixed abrasive

US Patent 4646710 · Granted Mar 3, 1987

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Technique for controlling temperature uniformity in crystal growth apparatus2023
Technique for controlling temperature uniformity in crystal growth apparatus2020
Increased polysilicon deposition in a CVD reactor2017
Crystal growth apparatus with ceramic coating and methods for preventing molten 2017
High-temperature process improvements using helium under regulated pressure2017
Method of making large surface area filaments for the production of polysilicon 2014
Method and apparatus for refining metallurgical grade silicon to produce solar g2012
System and method for crystal growing2012
System and method for crystal growing2012
Processing of fine silicon powder to produce bulk silicon2011
System and method for crystal growing2011
System and method for crystal growing2011