Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Covering metal structure for metallized metal layer in electronic part

Covering metal structure for metallized metal layer in electronic part

US Patent 4626479 · Granted Dec 2, 1986

Estimated economic value: $25,020,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wiring substrate, electronic device, and electronic module2023
Wiring substrate, electronic device, and electronic module2023
Wiring board and electronic device using the same2016
Printed circuit board, mount structure thereof, and methods of producing these2015
Wiring board and mounting structure using the same2014
Circuit board and mounting structure using the same2014
Method for producing wiring substrate2006
Wiring substrate2005
Semiconductor device having improved heat resistance1998