Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › LPE Semiconductor material transfer method

LPE Semiconductor material transfer method

US Patent 4547230 · Granted Oct 15, 1985

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device header and method of making same1988
Sharp edge formation on copper heatsinks1987
Die bonder with electrically driven scrubbing means1986
Selective semiconductor coating and protective mask therefor1986
Method of burnishing malleable films on semiconductor substrates1986
Method of bonding semiconductor devices to heatsinks1986
Flux-free photodetector bonding1985
InP:Te Protective layer process for reducing substrate dissociation1985
Simultaneous doped layers for semiconductor devices1985
Bonding pads for semiconductor devices1985
Method of soldering a light emitting device to a substrate1985
Multiple double heterojunction buried laser device1984