Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Single package epoxy resin system

Single package epoxy resin system

US Patent 4533715 · Granted Aug 6, 1985

Estimated economic value: $821,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compositions comprising PEDF-derived short peptides and uses thereof2023
Foam filled honeycomb and methods for their production1994
Ceramic reinforced glass matrix1992
Low energy cured composite repair system based on imidazole-blocked naphthyl-dii1992
Low energy cured composite repair system based on imidazole-blocked naphthyl-dii1992
Reactive polyimides for addition to thermosetting resins, and process for prepar1992
Low energy cured composite repair system based on epoxy resin with imidazole blo1992
Low energy cured composite repair system based on epoxy resin with imidazole blo1992
Cyanate resin-based foams1991
Cyanate resin-based foams1991
Toughened, high temperature resin matrix system1991
Toughened, high temperature resin matrix system1991