{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion", "item": "https://www.patentleaderboard.com/patent/4522667"}]}
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Home › Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion

Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion

US Patent 4522667 · Granted Jun 11, 1985

Estimated economic value: $3,400,000 ⓘ

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