Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer handling apparatus and method

Wafer handling apparatus and method

US Patent 4507078 · Granted Mar 26, 1985

Estimated economic value: $587,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and apparatus for test pattern forming and film property measurement2023
Methods and apparatus for test pattern forming and film property measurement2022
Methods and systems for material property profiling of thin films2020
Measurement method, measurement device, and non-transitory recording medium2020
Alignment device, splicing device, aligning method, and splicing method for opti2018
Measuring and controlling wafer potential in pulsed RF bias processing2017
Two-mode optical fiber and light transmission path2016
Optical fiber and optical transmission line2016
Optical fiber, optical transmission line, and method for manufacturing optical f2015
Roll-to-roll processing method and tools for electroless deposition of thin laye2013
Measuring and controlling wafer potential in pulsed RF bias processing2012
Methods of and apparatus for measuring and controlling wafer potential in pulsed2012