Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-speed, high pin-out LSI chip package

High-speed, high pin-out LSI chip package

US Patent 4498122 · Granted Feb 5, 1985

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Technique for effectively routing conduction paths in circuit layouts2000
Low-crosstalk modular electrical connector assembly1999
System and methods for assessing the suitability of analog lasers for broadband 1998
System and method for minimizing nonlinear distortion in optical communication s1997
Integrated circuit having reduced inductive noise1997
Balanced driver circuit for eliminating inductive noise1996
Process and apparatus for auditing crosstalk and characteristic impedances of pr1996
Balanced circuitry for reducing inductive noise of external chip interconnection1994
Article comprising a balanced driver circuit with less power dissipation than co1994