Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid integrated circuit component and printed circuit board mounting said component

Hybrid integrated circuit component and printed circuit board mounting said component

US Patent 4495546 · Granted Jan 22, 1985

Estimated economic value: $140,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plasma processing apparatus and plasma processing method2025
Laminating double-side circuit board, manufacturing method thereof, and multilay2006
Solid electrolytic capacitor and method of manufacturing same2003
Screening method for a multi-layered ceramic capacitor2002
Plating method and method for producing a multi-layered printed wiring board usi1996
Electroplating apparatus for coating a dielectric resonator1993
Integrated circuit device and manufacturing method thereof1992
Laminated ceramic capacitor1991
Conductor paste and method of manufacturing a multilayered ceramic body using th1989
Conductor paste and method of manufacturing a multilayered ceramic body using th1987