Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal conduction element for conducting heat from semiconductor devices to a cold plate

Thermal conduction element for conducting heat from semiconductor devices to a cold plate

US Patent 4479140 · Granted Oct 23, 1984

Estimated economic value: $22,570,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multiple radial finger contact cooling device1992
High conduction cooling module having internal fins and compliant interfaces for1991
High conduction flexible fin cooling module1991
Heat sink or similar article1989
Unitary slotted heat sink for semiconductor packages1986
Telescoping thermal conduction element for semiconductor devices1984
Thermal conduction element for semiconductor devices1983