Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for high speed nickel and gold electroplate system and article having improved corrosion resistance

Process for high speed nickel and gold electroplate system and article having improved corrosion resistance

US Patent 4411965 · Granted Oct 25, 1983

Estimated economic value: $3,070,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High speed copper electroplating process and bath therefor1985
Bath and process for high speed nickel electroplating1983
Bath and process for high speed nickel electroplating1983
Process for the electrodeposition of palladium1983
Process and composition for the electrodeposition of tin and tin alloys1983
Electroplating tin and tin alloys and baths therefor1982
Electrodeposition of bright copper1982
Silver electrodeposition process1981