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Home › Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity

Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity

US Patent 4358552 · Granted Nov 9, 1982

Estimated economic value: $5,301,000 ⓘ

Assignee

Morton Norwich Products

Inventors

Makoto Shinohara (47 patents)
James J. Miyashiro (2 patents)

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