Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dissolution of metals utilizing an aqueous H.sub.2 O.sub.2 -H.sub.2 SO.sub.4 -thioamide etchant

Dissolution of metals utilizing an aqueous H.sub.2 O.sub.2 -H.sub.2 SO.sub.4 -thioamide etchant

US Patent 4233113 · Granted Nov 11, 1980

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electroless copper plating1985
Dissolution of metals utilizing tungsten1985
Aluminum storage disc1985
Dissolution of metals utilizing tungsten-diol combinations1985
Solution for formation of black oxide1985
Electroless nickel plating1984
Dissolution of metals1984
Metal stripping composition and method1981
Dissolution of metals utilizing an aqueous H.sub.2 SO.sub.Y --H.sub.2 O.sub. -me1980
Dissolution of metals utilizing an aqueous H.sub.2 SO.sub.Y --H.sub.2 O.sub. -me1980
Dissolution of metals utilizing an aqueous H.sub.2 SO.sub.4 -H.sub.2 O.sub.2 -3-1980
Dissolution of metals utilizing an aqueous H.sub.2 SO.sub.4 -H.sub.2 O.sub.2 -3-1980