Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Potting and encapsulating material for electronic circuits

Potting and encapsulating material for electronic circuits

US Patent 4231916 · Granted Nov 4, 1980

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antenna element module2025
Antenna element module2024
High frequency gallium arsenide MMIC die coating method2003
Transparent compound and applications for its use2001
Method for manufacturing a light weight circuit module1994
RF absorbing ablating apparatus1988
Method for potting and encapsulating electronic circuits1981
Method for potting and encapsulating electronic circuits1981
Hybrid RF termination and connector system1981