Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of disposing electrical components above and below substrate

Semiconductor device and method of disposing electrical components above and below substrate

US Patent 12489078 · Granted Dec 2, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for preparing poly(carbonate-etherimide) compound2020
Semiconductor package with plated metal shielding and a method thereof2020
Semiconductor package with plated metal shielding and a method thereof2019