Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure with through vias

Package structure with through vias

US Patent 12489045 · Granted Dec 2, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Memristor, method of calculating hamming distance, and in-memory computing integ2025
Pressure sensor based on zinc oxide nanowires and method of manufacturing pressu2025
Eyepiece for head-mounted display and method for making the same2025
Optical lens and backlight module incorporating the same2015
Substrate for light emitting diode2013
Lens for light emitting diode2013
Phosphate glass based optical device and method2011
Handle of pistol nozzle2002
Handle2002
Pistol nozzle2002
Water gun handle2001
Pistol nozzle2001