Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hermetic sealed electronic assembly for non dielectric immersion cooling system

Hermetic sealed electronic assembly for non dielectric immersion cooling system

US Patent 12484190 · Granted Nov 25, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rack column assembly for a data center and method for assembly thereof2025
Hybrid liquid cooling arrangement for autonomous and immersion cooled racks2025
Hybrid liquid cooling arrangement for autonomous and immersion cooled racks2025
Cooling arrangement for cooling of a rack2025
Uninterruptible power supply having a liquid cooling device2025
Data center rack assembly and cooling fluid control method with leak alert2025
Data center rack assembly and cooling fluid control method with leak alert2025
Liquid cooling device mounted on a heat generating electronic component2025
Liquid cooling device mounted on a heat generating electronic component2025
Method for assembling a liquid cooling assembly of a family of liquid cooling as2025
Method and extraction system for extracting an electronic device from an immersi2025
Release tool for use with a push-fit valve2024