Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package including a surface with a plurality of roughness values and methods of forming the same

Semiconductor package including a surface with a plurality of roughness values and methods of forming the same

US Patent 12482735 · Granted Nov 25, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Memory management method, memory storage apparatus and memory control circuit un2025
Chip structure and method for forming the same2025
Muscle training gear2022
Twin-axis prestressed single-tee beam with lower flange and process of construct2000
Multi-functional test machine1999
Rotatably fastening blind rivet1999
Safety method of construction a prestressed cable-stay bridge1999
Multi-axis prestressed double-tee beam and method of construction1999
Multi-directional hydraulic swivel joint1997
Multi-functional hydraulic grip1996