Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density UO2 and high thermal conductivity UO2 composites by spark plasma sintering (SPS)

High density UO2 and high thermal conductivity UO2 composites by spark plasma sintering (SPS)

US Patent 12476016 · Granted Nov 18, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compact mechanical waveguides for impact devices2025
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2022
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2022
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2022
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2022
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2022
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2022
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2020
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2020
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2020
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2020
High density UO2 and high thermal conductivity UO2 composites by spark plasma si2020