Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for integrating diode sensors on micromachined wafer probes

System and method for integrating diode sensors on micromachined wafer probes

US Patent 12474377 · Granted Nov 18, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Transcutaneous electrical stimulation and light stimulation devices for treating2024
Methods and systems for treating hypertension using energy-stimulated acupunctur2022
Balanced unilateral frequency quadrupler2019
Balanced unilateral frequency quadrupler2019
Quasi-vertical diode with integrated ohmic contact base and related method there2019
Quasi-vertical diode with integrated ohmic contact base and related method there2019
Micromachined on-wafer probes and related method2016
Micromachined on-wafer probes and related method2016
Method of local electro-magnetic field enhancement of terahertz (THZ) radiation 2013
Method of local electro-magnetic field enhancement of terahertz (THZ) radiation 2013
Method of local electro-magnetic field enhancement of terahertz (THz) radiation 2012
Preferential crystal etching technique for the fabrication of millimeter and sub2002