Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laser heat sinking for integrating laser diode into recording heads at wafer level

Laser heat sinking for integrating laser diode into recording heads at wafer level

US Patent 12451666 · Granted Oct 21, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Physiologic cardiovascular pH balanced counter current electrolyte transfer and 2025
Heat-assisted magnetic recording head with an integrated photodiode2025
Heat-assisted magnetic recording head with an integrated photodiode2025
Heat-assisted magnetic recording head with an integrated photodiode2024
Heat-assisted magnetic recording head with an integrated photodiode2024
Heat sinking layer between a substrate and encasing layers of a recording head2023
Optical switches2023
Waveguide having plasmonic strips for heat-assisted magnetic recording2022
On-wafer integrated laser for heat-assisted magnetic recording2022
Heat sinking layer between a substrate and encasing layers of a recording head2022
Integrated laser transceiver2021
On wafer laser stability control for heat-assisted magnetic recording2020