Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Information handling system dual layer modular printed circuit board interposer

Information handling system dual layer modular printed circuit board interposer

US Patent 12439518 · Granted Oct 7, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Password encryption for servicing high security systems2025
Portable information handling system thermal module antenna system2025
System and method of dissipating heat from an information handling system2025
Kickstand with radio frequency (RF) window2025
Mobile gaming device2025
Devices, systems, and methods for printhead cleaning and diagnostics2025
System for thermal management of a handheld computing device2025
Apparatuses for contactless loading and imaging of microfluidic chips and relate2024
System and method for operating an aperture-coupled tunable ring antenna system 2024
Bonded hinge structure for an information handling system2024
Chip imaging module array2024
Devices, systems, and methods for obtaining sensor measurements2024