Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Off axis laser-based surface processing operations for semiconductor wafers

Off axis laser-based surface processing operations for semiconductor wafers

US Patent 12438001 · Granted Oct 7, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Large diameter silicon carbide wafers2025
Fill-in planarization system and method2025
Large dimension silicon carbide single crystalline materials with reduced crysta2024
Silicon carbide wafers with relaxed positive bow and related methods2024
Large diameter silicon carbide wafers2024
Reduced optical absorption for silicon carbide crystalline materials2024
Silicon carbide wafers with relaxed positive bow and related methods2023
Silicon carbide wafers with relaxed positive bow and related methods2021
Silicon carbide wafers with relaxed positive bow and related methods2020
Modular hand-held electronic device charging and monitoring system2015
Water treatment2014
Rod pump2005